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Thermal Measurement Imaging Module – TCM50K25DR

Thermal Measurement Imaging Module – TCM50K25DR
Thermal Measurement Imaging Module – TCM50K25DR
Thermal Measurement Imaging Module – TCM50K25DR
Thermal Measurement Imaging Module – TCM50K25DR
Thermal Measurement Imaging Module – TCM50K25DR
Thermal Measurement Imaging Module – TCM50K25DR
Thermal Measurement Imaging Module – TCM50K25DR
Thermal Measurement Imaging Module – TCM50K25DR
Thermal Measurement Imaging Module – TCM50K25DR
Thermal Measurement Imaging Module – TCM50K25DR
Thermal Measurement Imaging Module – TCM50K25DR
Thermal Measurement Imaging Module – TCM50K25DR

 

The TCM50K25DR is a compact long-wave infrared (LWIR) thermal imaging module designed to deliver reliable temperature measurement and clear thermal imaging for a wide range of embedded applications. Built on a 256×192 uncooled VOx detector with 12 µm pixel size, it offers good image clarity and thermal sensitivity (NETD ≤50 mK), making it suitable for both general monitoring and precise temperature analysis. The integrated 3.2 mm lens provides a practical field of view for common use cases such as industrial inspection, handheld devices, and smart sensing.

The module operates at up to 25 fps and includes built-in image processing, helping improve image stability, reduce noise, and enhance detail without requiring heavy external processing. It supports full-frame temperature output along with basic analysis functions like maximum, minimum, and center-point measurement. With dual measurement modes, users can choose between higher image quality or a wider temperature range depending on application needs, offering flexibility across different scenarios.

For system integration, the TCM50K25DR uses a DVP interface with I2C control, making it straightforward to integrate into embedded platforms. For evaluation and faster development, the TCM50K25DR-UKit provides a simple DVP-to-USB solution, allowing direct connection to a PC. With its small form factor, low power consumption, and balanced performance, the TCM50K25DR is a practical choice for engineers and product teams working on thermography, industrial monitoring, smart hardware, and AIoT applications.

 


Technical Information

 Product ID TCM50K25DR
 Sensor Uncooled VOx infrared detector (wafer-level package)
 Spectral Band 8μm ~ 14μm
 Image Pixels & Resolution 256(W) x 192(H)
 Pixel Size 12μm
 Frame Rate 25fps @ 256x192
 Thermal Sensitivity (NETD) ≤50mK @ 25°C
 Radiometric Accuracy ±2°C or ±2%
 Data Interface SPI / DVP
USB 2.0 (UVC) by TCM50K25D-UKit
 Operating Temperature -10°C ~ +75°C
 Operating Voltage 3.3V
DC 5V (TCM50K25D-UKit)
 Power Consumption Typ. 240 mW (normal)
≤600 mW (shutter)
 Dimensions 13mm × 13mm × 8.5mm
 Weight ≤3.0g
≤5.3g(with UKit)
 Lens Holder Integrated
 Field of View(D) 50° / 67°(Default) / 105°

Disclaimer: Product images and specifications are for reference only and may be subject to change without notice due to ongoing product improvements. For the most current information, please contact us.

Thermal Measurement Imaging Module – TCM50K25DR

FEATURES

WLP VOx infrared sensor 256x192 pixels
Spectral Band: 8μm ~14μm
Thermal Sensitivity(NETD): <50mK @25°C
Frame Rate: 25Hz for 50K(256(H)x192(V))
Data Interface: SPI / DVP
Data Interface(UKit): USB 2.0 (UVC)
SDK support: Windows, Linux, Android, RTOS

Datasheet

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$410.0
10 or more $330.0
50 or more $270.0
200 or more $235.0
1000 or more $215.0
  • Deliver Time: Available, 7~21 Days
  • Product ID: TCM50K25DR
  • Weight: 3.00g
  • Dimensions: 13.00mm x 13.00mm x 8.50mm

Available Options

Note:

We also support custom made service as your requirements.

For more details, please contact us.